| 规格： | Specification: |
| 电压/Voltage | 1.8V，3.3V |
| 温度/Temperature | -40℃ ~ 85℃/105℃ |
| 容量/Density | 1Gb / 2Gb / 4Gb/ 8Gb/ 16Gb |
| 封装/Package | TSOP48，FBGA63， FBGA67，FBGA48 |
| 速度/Speed | 20ns/25ns，30ns/45ns |
| 线宽/Width | x8/ x16 |
兼容传统的并行接口标准，高可靠性。可提供容量从1Gb到16Gb，1.8V / 3.3V两种电压，多种封装方式的产品，以满足不同应用场景。在网络通信，智能音箱，机顶盒等领域中广泛应用。
Dosilicon's PPI NAND Flash is designed with traditional parallel peripheral interface with high reliability. It provides capacities from 1Gb to 16Gb, two voltages (1.8V / 3.3V) and different package types compatible with various application scenarios. It is widely used in many fields such as network communication, AI speaker, STB, etc
| Type | Part Number | Density | Voltage | Speed(MHz/CLK) | Temp. Range | PKG Type | Datasheet |
|---|---|---|---|---|---|---|---|
|
PPI NAND |
FMND1G08S3D-IA |
1Gb |
1.8V |
45ns |
-40℃~85℃ |
TSOP 48(12x20mm) |
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FMND1G08S3D-ID |
VFBGA 63(9x11mm) |
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FMND1G08S3D-IF |
VFBGA 67(6.5x8mm) |
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| FMND1G08S3D-IE | VFBGA 48(6.5x5mm) | ||||||
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FMND1G08U3D-IA |
3.3V |
25ns |
TSOP 48(12x20mm) |
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FMND1G08U3D-ID |
VFBGA 63(9x11mm) |
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FMND1G08U3D-IF |
VFBGA 67(6.5x8mm) |
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FMND2G08S3D-IA |
2Gb |
1.8V |
45ns |
TSOP 48(12x20mm) |
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FMND2G08S3D-ID |
VFBGA 63(9x11mm) |
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FMND2G08S3D-IF |
VFBGA 67(6.5x8mm) |
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FMND2G08U3D-IA |
3.3V |
25ns |
TSOP 48(12x20mm) |
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FMND2G08U3D-ID |
VFBGA 63(9x11mm) |
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FMND2G08U3D-IF |
VFBGA 67(6.5x8mm) |
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FMND4G08S3B-ID |
4Gb |
1.8V |
30ns |
VFBGA 63(9x11mm) |
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FMND4G08S3C-ID |
VFBGA 63(9x11mm) |
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FMND4G08S3B-IA |
TSOP 48(12x20mm) |
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FMND4G08S3C-IA |
TSOP 48(12x20mm) |
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FMND4G08S3F-ID |
VFBGA 63(9x11mm) |
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DSND4G08S3D-ID |
VFBGA 63(9x11mm) |
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DSND4G08S3D-IA |
TSOP 48(12x20mm) |
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FMND4G08U3B-ID |
3.3V |
20ns |
VFBGA 63(9x11mm) |
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FMND4G08U3C-ID |
VFBGA 63(9x11mm) |
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FMND4G08U3B-IA |
TSOP 48(12x20mm) |
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FMND4G08U3C-IA |
TSOP 48(12x20mm) |
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DSND4G08U3D-ID |
VFBGA 63(9x11mm) |
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DSND4G08U3D-IA |
TSOP 48(12x20mm) |
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DSND8G08S3M-ID |
8Gb |
1.8V |
30ns |
VFBGA 63(9x11mm) |
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DSND8G08S3N-ID |
VFBGA 63(9x11mm) |
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DSND8G08S3Q-ID |
VFBGA 63(9x11mm) |
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DSND8G08S3Q-IA |
TSOP 48(12x20mm) |
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DSND8G08S3I-ID |
VFBGA 63(9x11mm) |
Contact us |
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DSND8G08U3N-ID |
3.3V |
20ns |
VFBGA 63(9x11mm) |
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DSND8G08U3N-IA |
TSOP 48(12x20mm) |
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DSND8G08U3Q-ID |
VFBGA 63(9x11mm) |
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DSND8G08U3Q-IA |
TSOP 48(12x20mm) |
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| DSND6G08S3Q-ID | 16Gb | 1.8V | 30ns | VFBGA 63(9x11mm) |
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| DSND6G08S3S-ID | VFBGA 63(9x11mm) | Contact us | |||||
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DSND6G08U3Q-ID |
3.3V |
20ns |
VFBGA 63(9x11mm) |
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FMND1G08U3D-JA |
1Gb |
3.3V |
25ns |
-40℃~105℃ |
TSOP 48(12x20mm) |
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DSND4G08S3D-A2D |
4Gb |
1.8V |
30ns |
VFBGA 63(9x11mm) |
Contact us | ||
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DSND4G08U3D-A2D |
3.3V |
20ns |
VFBGA 63(9x11mm) |
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DSND8G08S3Q-JD |
8Gb |
1.8V |
30ns |
VFBGA 63(9x11mm) |
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|
eMMC |
DS55B08D3A2-EA |
8Gb |
3.3V |
200MHz |
-25℃~85℃ |
FBGA 153(11.5x13mm) |
Contact us |
|
DS55B08D5A2-EA |
Contact us |
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DS55B32D5A1-EA |
32Gb |
Contact us |
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DS55B64D5A1-EA |
64Gb |
Contact us |
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DS55B64E5A1-EA |
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DS55B64C5B1-EA |
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DS55BC8E5M1-EA |
128Gb |
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DS55B08D5A3-A2A |
8Gb |
3.3V |
-40℃~105℃ |
BGA 153(11.5x13mm) |
Contact us |
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DS55B16D5A3-A2A |
16Gb |
BGA 153(11.5x13mm) |
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DS55B32D5A3-A2A |
32Gb |
BGA 153(11.5x13mm) |
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DS55B64E5A4-A2A |
64Gb |
BGA 153(11.5x13mm) |
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DS55BC8E5M4-A2A |
128Gb |
BGA 153(11.5x13mm) |
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